CASE STUDY
Global Electronics Manufacturer Requires Reliable Thermal Interface Gap Filler Pad
THE CHALLENGE
A global electronics manufacturer was not happy with their current supplier of thermal interface pads. Due to the shear movement of this application, the manufacturer needed a thermal interface gap pad that would not tear under motion.
DESIGN REQUIREMENTS
- Maximum surface contact under low closure force
- Thermal performance in excess of 1 W/m-K
- Consistent function after multiple cycles
- Must not tear under shear motion
- Reasonable easy to assemble to chassis
KEY CUSTOMER REQUIREMENTS
- Low cost
- Thermal pad must attach to chassis/heat sink
PRODUCTS
THE SOLUTION
Parker Chomerics THERM-A-GAP 570 gap filler pads, combined with THERMATTACH T405 attachment tape and a Mylar layer laminated to the top surface of the 570 pad provided a multi-layered solution that allowed for shear motion on the gap pad without tearing.
Maximum surface contact can be made without sacrificing thermal performance, as the T405 attachment tape allows for easy installation and reliable adhesion to the chassis.
CONCLUSION
The recommended solution for this electronics component manufacturer was to use a Parker Chomerics THERM-A-GAP G570 gap filler pads, combined with THERMATTACH T405 attachment tape. This combination approach was cost competitive, while providing the customer with a better overall solution.
The 570 pad achieved excellent surface contact, and the customer’s thermal performance requirements were exceeded. The pad functioned well under multiple cycles and easy installation was achieved.
Thermally Conductive Pads
Parker Chomerics THERM-A-GAP™ gap filler pads are a family of low soft, thermally conductive silicone and non-silicone elastomers for applications where heat must be conducted over a large and variant gap between a semiconductor component and a heat dissipating surface. Learn More.
We’re constantly innovating in our drive to create the most advanced EV solutions.
2023 Thermal Interface Material Innovations
Over the last year, Parker Chomerics has developed new, state of the art thermal interface materials, or TIMs, for use across industries and applications. These novel products continue to expand the portfolio of high performance, high reliability thermal gap pads and dispensable thermal gels.
Can't find what you're looking for? Talk to one of our experts.
