SOLUTION
The recommended solution for this electronics component manufacturer was to use a Parker Chomerics CHO-SEAL® 1285 conductive elastomer material was selected in a molded gasket shape.
The molded gasket to replace the metal gasket and FIP material was customized to meet the large compression range and grounding required by the customer. The shielding effectiveness and ground performance was met with this solution.
Parker Chomerics was also able to optimize the gasket profile to enhance the compression force required to achieve grounding.